Chen, XiaomeiShaw, ChristopherGelman, LeonidGrattan, Kenneth T. V.2019-07-222019-07-222019-03-11Chen X, Shaw C, Gelman L, Grattan KTV. (2019) Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques. Measurement, Volume 139, June 2019, pp. 387-4020263-2241https://doi.org/10.1016/j.measurement.2019.03.026https://dspace.lib.cranfield.ac.uk/handle/1826/14371In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.enAttribution-NonCommercial-NoDerivatives 4.0 Internationalhttp://creativecommons.org/licenses/by-nc-nd/4.0/Interface adhesionBond strengthCoating-substrate systemMinimum-destructive testingArticle