Browsing by Author "Al-Sayegh, Rajab"

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    The importance of wavelength for tight temperature control during µ-laser assisted machining
    (Sage, 2020-05-22) Dennis, Ashley; Goel, Saurav; Al-Sayegh, Rajab
    The area of single point diamond turning of brittle materials like semiconductors and ceramics is significantly benefitted by incorporation of laser assistance. In a new developmental technology that is now recognized as micro-laser-assisted machining (μ-LAM), a laser is shone through a diamond tool to soften the high-pressure phase transformed ductile machining phases that in turn allows thermal softening and thereby enables a higher material removal rate during ductile mode machining. One of the lasers currently used in μ-LAM is the neodymium-doped yttrium aluminum garnet (Nd:YAG) laser operating at 100 W (continuous wave) at the wavelength of 1064 nm. Although this configuration has worked to the benefit of the technology, here we report futuristic developments that will significantly enhance temperature control by selecting a laser wavelength according to the material being machined, allowing tunable machining properties. The concept is illustrated with sample calculations for μ-LAM of silicon, and it appears to offer better target temperatures, thus enhancing the performance of the μ-LAM process.
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    Suppressing scratch-induced brittle fracture in silicon by geometric design modification of the abrasive grits
    (Elsevier, 2018-07-17) Kovalchenko, Andrii M.; Goel, Saurav; Zakiev, Islam M.; Pashchenko, Evgeniy A.; Al-Sayegh, Rajab
    The overarching goal of this research was to investigate the application of spherically shaped abrasive particles in achieving ductile-mode cutting. Scratching experiments were carried out to assess the differences between arbitrarily and spherically shaped diamond and tungsten carbide (WC) grits in inducing brittle fracture or ductile plasticity in single-crystal silicon. It was observed that the arbitrarily shaped particles produce brittle fracture in contrast to the spherically shaped grits. The sharp edges and corners of grits result in high tensile stress-concentrated regions causing cracking and spalling. Contrary to this, spherically shaped WC particles induce uniform cutting pressure, which suppresses the extent of the brittle fracture and the mode of material removal was completely dominated by ductile-cutting until a threshold load for ductile-to-brittle transition (the first cracks appearance). These observations are expected to provide a suitable pathway in making the Diamond Wire Sawing machining operations more robust by providing a control on brittle damage.
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    Surface defects incorporated diamond machining of silicon
    (IOP, 2020-07-31) Khatri, Neha; Barkachary, Borad; Muneeswaran, B.; Al-Sayegh, Rajab; Luo, Xichun; Saurav, Goel
    This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the Surface Defect Machining (SDM) method. The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating, cryogenic cooling, electric pulse or ultrasonic elliptical vibration. The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode. This paper made use of Raman spectroscopy data, average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional Single Point Diamond Turning (SPDT) and SDM while incorporating surface defects in the (i) circumferential and (ii) radial directions. Complimentary 3D Finite Element Analysis (FEA) was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer. It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness (Ra) of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters. The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases. FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance. The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard, brittle materials such as SiC, ZnSe and GaAs as well as hard steels