Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates
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Wright, Robert V.
Hakemi, Ghazal
Kirby, Paul B.
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0167-9317
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R.V. Wright, G. Hakemi, P.B. Kirby. Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates. Microelectronic Engineering, Volume 88, Issue 6, June 2011, Pages 1006–1009.
Abstract
Thin film bulk acoustic resonators (FBARs) have been directly integrated on liquid crystal polymer (LCP) substrates for application to the field of flexible electronics. Particular developments required were chemo-mechanical polishing for LCP roughness reduction to enable growth of high quality ZnO films and a through substrate deep reactive ion etch process. Q values of up to 126 and 78 for series and parallel resonances combined with an electromechanical coefficient ∼ 6.7% were achieved. Further device development is needed but this performance is already sufficient for some chemical/biological sensing applications.
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FBAR, Flexible electronics, LCP, RF MEMS
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NOTICE: this is the author’s version of a work that was accepted for publication in Microelectronic Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Microelectronic Engineering, Volume 88, Issue 6, June 2011, Pages 1006–1009. DOI:10.1016/j.mee.2011.01.038