Dataset for Measurement of thermal conductivity of epoxy resins during cure
Date published
2018-07-12 08:45
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Supervisor/s
Journal Title
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Publisher
Cranfield University
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Dataset
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Citation
Skordos, Alex; Struzziero, Giacomo; Remy, Berenice (2018). Measurement of thermal conductivity of epoxy resins during cure. Cranfield Online Research Data (CORD). Dataset. https://doi.org/10.17862/cranfield.rd.5841240
Abstract
- Thermal_conductivity_glycerine: Experimental and FE data of the thermal conductivity test run on glycerine at 100 degC and 4 degC. Includes also the sensitivity analysis of the measurement on thermocouple misplacement.
- RTM6_cure_kinetics_results: Includes the isothermal and dynamic data for the RTM6 cure kinetics characterisation and the corresponding model. It also includes the sensitivity analysis on period and amplitude influence for RTM6
- 890RTM_cure_kinetics_results: Includes the isothermal and dynamic data for the 890RTM cure kinetics characterisation and the corresponding model. It also includes the sensitivity analysis on period and amplitude influence for 890RTM
- XU3508_cure_kinetics_results: Includes the isothermal and dynamic data for the XU3508 cure kinetics characterisation and the corresponding model.
- Di Benedetto_XU3508: Includes the dataused to build the Di Benedetto equation for the XU3508 resin system and the corresponding model
- Cp_density_conductivity_data: Includes the Cp data and model, the density and the thermal conductivity data for the three resin systems under investigation: RTM6, 890RTM and XU3508
- Thermal_conductivity_model: Includes the data from the thermal conductivity tests for the three resin system and the fitting of the experimental data with the analytical model.
Description
Software Description
Software Language
Github
Keywords
'epoxy', 'cure', 'thermal conductivity', 'Composite and Hybrid Materials', 'Polymers and Plastics'
DOI
10.17862/cranfield.rd.5841240
Rights
CC BY 4.0
Funder/s
EPSRC